Application: Electronic And Electrical Components, General Grade, Filling Grade, Food Grade
Grade: Molding
Feature: High Strength, High Temperature Resistance, Standard Grade, Low Temperature Resistance, Hydrolysis Resistance, High Rigidity, Chemical Resistance
Temperature Resistance: -190°c To +370°c
Low Friction Coefficient: 0.05-0.10
Density: 2.1-2.3
Water Absorption: Under 0.01%
Shrinkage: < 0.4%
Tensile Strength: ≥ 8 MPa
Artículo | Unidad | Valor |
| Gravedad | g/cm3 | 2.1-2.3 |
| Resistencia a la tracción | MPa | ≥ 8 |
| Alargamiento | % | ≥ 25 |
| Rigidez dieléctrica | Kv/mm | 40 |
| Especificación | Según sus necesidades | |
| Absorción de agua | % | 0.05 – 0.10 |
| Paquete de transporte | Caja de plástico y madera |
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